Research output

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  1. 2017
  2. Published

    Thin Film Adhesion of Flexible Electronics Influenced by Interlayers

    Kleinbichler, A., Bartosik, M., Völker, B. & Cordill, M., 2017, In: Advanced engineering materials. 19.2017, 4, 7 p., 1600665.

    Research output: Contribution to journal › Article › Research › peer-review

  3. 2016
  4. Published

    Correlative microstructure and topography informed nanoindentation of copper films

    Bigl, S., Schöberl, T., Wurster, S., Cordill, M. & Kiener, D., 25 Dec 2016, In: Surface & coatings technology. 308.2016, 25 December, p. 404-413 10 p.

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    The effect of size on the strength of FCC metals at elevated temperatures: annealed copper

    Wheeler, J. M., Kirchlechner, C., Micha, J-S., Michler, J. & Kiener, D., 1 Dec 2016, In: Philosophical magazine. 96.2016, 32-34, p. 3379-3395 17 p.

    Research output: Contribution to journal › Article › Research › peer-review

  6. E-pub ahead of print

    Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces

    Kleinbichler, A., Zechner, J. & Cordill, M., 2 Nov 2016, (E-pub ahead of print) In: Microelectronic engineering. 167.2017, 5 January, p. 63-68 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

  7. Published

    Grain growth during cyclic straining of copper film revealed with in-situ resistance measurements

    Cordill, M. & Glushko, O., 25 Oct 2016.

    Research output: Contribution to conference › Poster › Research › peer-review

  8. Published

    Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

    Bigl, S., Wurster, S., Cordill, M. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612.2016, 1 August, p. 153-164 12 p.

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    Evaluating reliability of flexible electronic materials with combined electromechanical testing techniques

    Cordill, M., 25 May 2016.

    Research output: Contribution to conference › Presentation › Research › peer-review

  10. Published

    Examining nanoindentation imprints with in-situ AFM-SEM

    Cordill, M., Kreith, J., Strunz, T. & Fantner, E. J., 30 Mar 2016.

    Research output: Contribution to conference › Poster › Research › peer-review

  11. Published

    Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis

    Bigl, S., Wurster, S., Cordill, M. J. & Kiener, D., 22 Mar 2016.

    Research output: Contribution to conference › Presentation › Research

  12. Published

    33-2: Invited Paper: Evaluating Reliability of Flexible Electronic Materials with Combined Electro-Mechanical Testing Techniques

    Cordill, M., Berger, J. & Jörg, T., 2016, Digest of technical papers / Society for Information Display, SID. (Digest of technical papers / Society for Information Display, SID).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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