Research output

  1. 2016
  2. Published

    Residual lifetime determination of low temperature co-fired ceramics

    Majer, Z., Štegnerová, K., Hutar, P., Pletz, M., Bermejo, R. & Náhlík, L., 2016, Advances in Fracture and Damage Mechanics XV. Trans Tech Publications, Vol. 713. p. 266-269 4 p. (Key Engineering Materials; vol. 713).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  3. 2015
  4. Published
  5. Published

    Mechanical characterization of miniaturized functional substrates and components in different environments

    Bermejo, R., Krautgasser, C., Deluca, M., Pletz, M., Supancic, P., Aldrian, F. & Danzer, R., 1 Apr 2015

    Research output: Other contributionResearch

  6. Published

    Stress and Deflection Development During Die Embedding into Printed Circuit Boards

    Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 2015, In: Materials Today: Proceedings. 2, 2, p. 4196-4205 10 p.

    Research output: Contribution to journalArticleResearchpeer-review

  7. 2014
  8. Published

    Multi-scale finite element modeling to describe rolling contact fatigue in a wheel-rail test rig

    Pletz, M., Daves, W., Yao, W., Kubin, W. & Scheriau, S., Dec 2014, In: Tribology International. 80, p. 147-155

    Research output: Contribution to journalArticleResearchpeer-review

  9. Published

    Rolling Contact Fatigue of Three Crossing Nose Materials—Multiscale FE Approach

    Pletz, M., Daves, W., Yao, W. & Ossberger, H., 15 Jun 2014, In: Wear. 314, 1–2, p. 69-77 9 p.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

    Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  11. Published

    Numerical Analysis of Sub-Critical Crack Growth in Particulate Ceramic Composites

    Majer, Z., Pletz, M., Krautgasser, C., Nalik, L., Hutar, P. & Bermejo Moratinos, R., 2014, In: Procedia Materials Science. 3, p. 2071-2076

    Research output: Contribution to journalArticleResearchpeer-review

  12. 2013
  13. Published

    Multi-physics simulation of the component attachment within embedding process

    Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  14. Published

    A new roughness parameter to evaluate the near-surface deformation in dry rolling/sliding contact

    Kubin, W. K., Pletz, M., Daves, W. & Scheriau, S., 2013, In: Tribology International. 67, p. 132-139

    Research output: Contribution to journalArticleResearchpeer-review

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