Research output

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  1. 2019
  2. Published

    Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

    Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Thermal Expansion and Other Thermodynamic Properties of α2-Ti3Al and γ-TiAl Intermetallic Phases from First Principles Methods

    Holec, D., Abdoshahi, N., Mayer, S. & Clemens, H., 19 Apr 2019, In: Materials. 12.2019, 8, 11 p.

    Research output: Contribution to journal › Article › Research › peer-review

  4. Published

    Experimental Chemistry and Structural Stability of AlNb3 Enabled by Antisite Defects Formation

    Koutná, N., Erdely, P., Zöhrer, S., Franz, R., Du, Y., Liu, S., Mayrhofer, P. H. & Holec, D., 3 Apr 2019, In: Materials. 12.2019, 7, p. 1-11 11 p., 1104.

    Research output: Contribution to journal › Article › Research › peer-review

  5. Published

    An improved engineering approach to assess crack arrays: an Addendum to Arch. Appl. Mech. 84 (2014) 1325–1337

    Kienzler, R., Fischer, F-D. & Wessel, A., Apr 2019, In: Archive of applied mechanics. 89.2019, 4, p. 731 - 736 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

  6. Published

    Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

    Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 Mar 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Published

    Deformation-induced phase transformation in a Co-Cr-W-Mo alloy studied by high-energy X-ray diffraction during in-situ compression tests

    Weißensteiner, I., Petersmann, M., Erdely, P., Stark, A., Antretter, T., Clemens, H. & Maier-Kiener, V., Feb 2019, In: Acta materialia. 164.2019, February, p. 272-282 11 p.

    Research output: Contribution to journal › Article › Research › peer-review

  8. Published

    A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip

    Gschwandl, M., Fuchs, P. F., Antretter, T., Pfost, M., Mitev, I., Tao, Q., Krivec, T., Schingale, A. & Decker, M., 2019, p. 1509-1514.

    Research output: Contribution to conference › Paper › peer-review

  9. Published

    An ab initio study of thermodynamic and mechanical stability of stoichiometric Fe2CoAl polymorphs

    Friák, M., Oweisová, S., Pavlu, J., Holec, D. & Šob, M., 2019.

    Research output: Contribution to conference › Poster › Research

  10. Published

    Crystallographic orientation dependent maximum layer thickness of cubic AlN in CrN / AlN multilayers

    Chen, Z., Holec, D., Bartosik, M., Mayrhofer, P. H. & Zhang, Z., 2019, In: Acta materialia. 168.2019, 15 April, p. 190-202 13 p.

    Research output: Contribution to journal › Article › Research › peer-review

  11. Published

    Cyclic heat-up and damage-relevant substrate plastification of single- and bilayer coated milling inserts evaluated numerically

    Nemetz, A., Daves, W., Klünsner, T., Ecker, W., Schäfer, J., Czettl, C. & Antretter, T., 2019, In: Surface & coatings technology. 360.2019, February, p. 39-49 11 p.

    Research output: Contribution to journal › Article › Research › peer-review

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