Research output

  1. 2014
  2. Published

    Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

    Antretter, T., Otremba, R., Karunamurthy, B. & Pélisset, T., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  3. Published
  4. Published
  5. Published
  6. Published

    Constitutive analysis and microstructure evolution of the high-temperature deformation behavior of an advanced intermetallic multi-phase gamma-TiAl-based alloy

    Werner, R., Schwaighofer, E., Schloffer, M., Clemens, H., Lindemann, J. & Mayer, S., 2014, Advanced Materials Research. p. 807-812

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  7. Published
  8. Published
  9. Published

    Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

    Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Determination of cyclic mechanical properties of thin copper layers for PCB applications

    Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G. & Schöngrundner, R., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. p. 1-8

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  11. Published

    Development status, applications and perspectives of advanced intermetallic titanium aluminides

    Clemens, H. & Mayer, S., 2014, Materials Science Forum. p. 15-20

    Research output: Chapter in Book/Report/Conference proceedingConference contribution