Research output

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2024
Published
Backside metallization affects residual stress and bending strength of the recast layer in laser-diced Si
Ziegelwanger, T., Reisinger, M., Matoy, K., Medjahed, A. A., Zalesak, J., Gruber, M., Meindlhumer, M. & Keckes, J., Oct 2024, In: Materials Science in Semiconductor Processing. 181, 108579.
Research output: Contribution to journal › Article › Research › peer-review
2019
Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior
Du, C., Soeler, R., Völker, B., Matoy, K., Zechner, J., Langer, G., Reisinger, M., Todt, J., Kirchlechner, C. & Dehm, G., 1 Dec 2019, In: Materialia. 8.2019, 100503.
Research output: Contribution to journal › Article › Research › peer-review
2009
Published
Micro-Mechanical Characterization of Silicon based Dielectric Films and Metal/Dielectric Interfaces
Matoy, K., 2009
Research output: Thesis › Doctoral Thesis

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