Materials Science in Semiconductor Processing, 1369-8001
Journal
| ISSNs | 1369-8001 |
|---|
1 - 1 out of 1Page size: 10
Research output
- 2024
- Published
Backside metallization affects residual stress and bending strength of the recast layer in laser-diced Si
Ziegelwanger, T., Reisinger, M., Matoy, K., Medjahed, A. A., Zalesak, J., Gruber, M., Meindlhumer, M. & Keckes, J., Oct 2024, In: Materials Science in Semiconductor Processing. 181, 108579.Research output: Contribution to journal › Article › Research › peer-review
