Research output

  1. 2015
  2. Published

    Tracking of Grain Boundary Movement Due to (Thermo-) Mechanical Deformation

    Wurster, S., Bigl, S., Renk, O., Cordill, M. J., Hohenwarter, A., Pippan, R. & Kiener, D., 24 Nov 2015.

    Research output: Contribution to conferencePresentationResearch

  3. Published

    In-Situ Measurements of Free-Standing, Ultra-Thin Film Cracking in Bending

    Hintsala, E., Kiener, D., Jackson, J. & Gerberich, W. W., 1 Nov 2015, In: Experimental mechanics. 55, 9, p. 1681-1690 10 p.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published
  5. Published

    In Situ TEM Microcompression of Single and Bicrystalline Samples: Insights and Limitations

    Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 19 May 2015, In: JOM. 67, 8, p. 1704 1712 p.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    Fracture mechanics of thin film systems on the sub-micron scale

    Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  7. Published

    Microstructure and mechanical properties of CuxNb1- x alloys prepared by ball milling and high pressure torsion compacting

    Abad, M. D., Parker, S., Kiener, D., Primorac, M. M. & Hosemann, P., 5 May 2015, In: Journal of alloys and compounds. 630, p. 117-125 9 p.

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published

    Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary

    Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 15 Apr 2015, In: Scripta materialia. 100, p. 94-97 4 p.

    Research output: Contribution to journalArticleResearchpeer-review

  9. Published

    Influence of Microstructure on the Deformation Behaviour of Chromium

    Fritz, R., Wimler, D., Krautgasser, C., Leitner, A., Maier, V. & Kiener, D., 9 Apr 2015.

    Research output: Contribution to conferencePosterResearch

  10. Published

    Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

    Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published