Research output

  1. 2014
  2. Published

    Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards

    Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  3. Published

    Verbesserung der Thermoschockbeständigkeit von Si3N4-Werkzeugen für metallurgische Anwendungen durch eine Wärmebehandlung

    Danzer, R., Harrer, W. & Berroth, K., 2014, Praktische Metallographie Sonderband. p. 175-180

    Research output: Chapter in Book/Report/Conference proceedingChapterResearch

  4. 2013
  5. Published

    Multi-physics simulation of the component attachment within embedding process

    Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  6. Published

    3D Netzwerksimulationen von Varistoren mit verschiedenen Korngrößenverteilungen

    Hofstätter, M. & Supancic, P., 2013, In: Berg- und hüttenmännische Monatshefte : BHM. 158, p. 206-2010

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    A new roughness parameter to evaluate the near-surface deformation in dry rolling/sliding contact

    Kubin, W. K., Pletz, M., Daves, W. & Scheriau, S., 2013, In: Tribology International. 67, p. 132-139

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published

    C-AFM and KPFM approach to inverstigate the electrical properties of single grain boundaries in ZnO varistor devices

    Nevosad, A., Hofstätter, M., Wiessner, M., Supancic, P. & Teichert, C., 2013, Proc. of SPIE, Oxide-based Materials and Devices IV. p. 1-10

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  9. Published

    Crack path prediction in layered ceramics designed with residual stresses

    Bermejo Moratinos, R., 2013, Proceedings of the 4th International Conference on Crack Paths. p. 1-1

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  10. Published

    Effect of the electric conductivity on the modeling of the poling process of ferroelectric components

    Schwaab, H., Deluca, M., Supancic, P. & Kamlah, M., 2013, In: Journal of the mechanics and physics of solids. 61, p. 504-516

    Research output: Contribution to journalArticleResearchpeer-review

  11. Published

    Einfluss der Messunsicherheit auf die Ermittlung der Weibull-Verteilung

    Danzer, R., 2013.

    Research output: Contribution to conferencePosterResearchpeer-review

  12. Published

    Fracture Behaviour of Layered Alumina Microstructural Composites with Highly Textured Layers

    Pavlacka, R., Bermejo Moratinos, R., Chang, Y., Green, D. J. & Messing, G. L., 2013, In: Journal of the American Ceramic Society. 96, p. 1577-1585

    Research output: Contribution to journalArticleResearchpeer-review