Research output

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  1. 2017
  2. E-pub ahead of print

    Designing a novel functional-structural NiTi/hydroxyapatite composite with enhanced mechanical properties and high bioactivity

    Zhang, L., He, Z. Y., Tan, J., Zhang, Y. Q., Stoica, M., Calin, M., Prashanth, K. G., Cordill, M., Jiang, Y. H., Zhou, R. & Eckert, J., 5 Jan 2017, (E-pub ahead of print) In: Intermetallics. 84.2017, May, p. 35-41 7 p.

    Research output: Contribution to journal › Article › Research › peer-review

  3. Published

    Influence of extreme thermal cycling on metal-polymer interfaces

    Putz, B., Völker, B., Semprimoschnig, C. & Cordill, M. J., 5 Jan 2017, In: Microelectronic engineering. 167.2017, 5 January, p. 17-22 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

  4. Published

    Mechanical and Interfacial Integrity of Metal-Polymer Multilayer Systems

    Putz, B., 2017

    Research output: Thesis › Doctoral Thesis

  5. Published

    The driving force governing room temperature grain coarsening in thin gold films

    Glushko, O. & Cordill, M., 2017, In: Scripta Materialia. 130.2017, 15 March, p. 42-45 4 p.

    Research output: Contribution to journal › Article › Research › peer-review

  6. Published

    Thin Film Adhesion of Flexible Electronics Influenced by Interlayers

    Kleinbichler, A., Bartosik, M., Völker, B. & Cordill, M., 2017, In: Advanced engineering materials. 19.2017, 4, 7 p., 1600665.

    Research output: Contribution to journal › Article › Research › peer-review

  7. 2016
  8. Published

    Correlative microstructure and topography informed nanoindentation of copper films

    Bigl, S., Schöberl, T., Wurster, S., Cordill, M. & Kiener, D., 25 Dec 2016, In: Surface & coatings technology. 308.2016, 25 December, p. 404-413 10 p.

    Research output: Contribution to journal › Article › Research › peer-review

  9. E-pub ahead of print

    Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces

    Kleinbichler, A., Zechner, J. & Cordill, M., 2 Nov 2016, (E-pub ahead of print) In: Microelectronic engineering. 167.2017, 5 January, p. 63-68 6 p.

    Research output: Contribution to journal › Article › Research › peer-review

  10. Published

    Grain growth during cyclic straining of copper film revealed with in-situ resistance measurements

    Cordill, M. & Glushko, O., 25 Oct 2016.

    Research output: Contribution to conference › Poster › Research › peer-review

  11. Published

    Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

    Bigl, S., Wurster, S., Cordill, M. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612.2016, 1 August, p. 153-164 12 p.

    Research output: Contribution to journal › Article › Research › peer-review

  12. Published

    Evaluating reliability of flexible electronic materials with combined electromechanical testing techniques

    Cordill, M., 25 May 2016.

    Research output: Contribution to conference › Presentation › Research › peer-review

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