Research output

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  1. 2019
  2. Published

    Fracture properties of ultrafine grain chromium correlated to single dislocation processes at room temperature

    Issa, I., Hohenwarter, A., Fritz, R. & Kiener, D., 20 May 2019, In: Journal of Materials Research. 2019

    Research output: Contribution to journal › Article › Research › peer-review

  3. Published

    Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

    Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. Published

    TEM characterisation and Raman spectroscopy of vitrinite

    Vranjes-Wessely, S., Misch, D., Kiener, D., Rantitsch, G., Groß, D. & Sachsenhofer, R., May 2019, p. 459. 460 p.

    Research output: Contribution to conference › Abstract › peer-review

  5. Published

    Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

    Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 Mar 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. Published

    Rate limiting deformation mechanisms of bcc metals in confined volumes

    Kiener, D., Fritz, R., Alfreider, M., Leitner, A., Pippan, R. & Maier-Kiener, V., 1 Mar 2019, In: Acta Materialia. 166.2019, March, p. 687-701 15 p.

    Research output: Contribution to journal › Article › Research › peer-review

  7. Published

    Bioinspired nacre-like alumina with a bulk-metallic glass-forming alloy as a compliant phase

    Wat, A., Lee, J. I., Ryu, C. W., Gludovatz, B., Kim, J., Tomsia, A. P., Ishikawa, T., Schmitz, J., Meyer, A., Alfreider, M., Kiener, D., Park, E. S. & Ritchie, R. O., 27 Feb 2019, In: Nature Communications. 10.2019, 1, 12 p., 961.

    Research output: Contribution to journal › Article › Research › peer-review

  8. Published

    Anneal hardening and elevated temperature strain rate sensitivity of nanostructured metals: Their relation to intergranular dislocation accommodation

    Renk, O., Maier-Kiener, V., Issa, I., Li, J. H., Kiener, D. & Pippan, R., 15 Feb 2019, In: Acta materialia. 165.2019, 165, p. 409-419 11 p.

    Research output: Contribution to journal › Article › Research › peer-review

  9. Published

    Deformation-induced phase transformation in a Co-Cr-W-Mo alloy studied by high-energy X-ray diffraction during in-situ compression tests

    Weißensteiner, I., Petersmann, M., Erdely, P., Stark, A., Antretter, T., Clemens, H. & Maier-Kiener, V., Feb 2019, In: Acta materialia. 164.2019, February, p. 272-282 11 p.

    Research output: Contribution to journal › Article › Research › peer-review

  10. Published

    A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip

    Gschwandl, M., Fuchs, P. F., Antretter, T., Pfost, M., Mitev, I., Tao, Q., Krivec, T., Schingale, A. & Decker, M., 2019, p. 1509-1514.

    Research output: Contribution to conference › Paper › peer-review

  11. Published

    Cyclic heat-up and damage-relevant substrate plastification of single- and bilayer coated milling inserts evaluated numerically

    Nemetz, A., Daves, W., Klünsner, T., Ecker, W., Schäfer, J., Czettl, C. & Antretter, T., 2019, In: Surface & coatings technology. 360.2019, February, p. 39-49 11 p.

    Research output: Contribution to journal › Article › Research › peer-review

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