Nanoscale residual stress depth profiling by focused ion beam milling and eigenstrain analysis
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In: Materials and Design, Vol. 145, 2018, p. 55-64.
Research output: Contribution to journal › Article › Research › peer-review
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TY - JOUR
T1 - Nanoscale residual stress depth profiling by focused ion beam milling and eigenstrain analysis
AU - Korsunsky, Alexander M.
AU - Salvati, E.
AU - Lunt, A.G.J.
AU - Sui, T.
AU - Mughal, Z.M.
AU - Daniel, Rostislav
AU - Keckes, Jozef
AU - Bemporad, E.
AU - Sebastiani, M.
PY - 2018
Y1 - 2018
U2 - 10.1016/j.matdes.2018.02.044
DO - 10.1016/j.matdes.2018.02.044
M3 - Article
VL - 145
SP - 55
EP - 64
JO - Materials and Design
JF - Materials and Design
SN - 0264-1275
ER -