Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide

Research output: Contribution to journalArticleResearchpeer-review

Standard

Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide. / Cordill, Megan; Taylor, Aidan; Schalko, J. et al.
In: International journal of materials research : IJMR ; Zeitschrift für Metallkunde, 2011, p. 729-734.

Research output: Contribution to journalArticleResearchpeer-review

Bibtex - Download

@article{77836a4f088144fdad5de6aba2ec21ec,
title = "Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide",
author = "Megan Cordill and Aidan Taylor and J. Schalko and Gerhard Dehm",
year = "2011",
language = "English",
pages = "729--734",
journal = "International journal of materials research : IJMR ; Zeitschrift f{\"u}r Metallkunde",
issn = "1862-5282",
publisher = "Carl Hanser Verlag GmbH & Co. KG",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide

AU - Cordill, Megan

AU - Taylor, Aidan

AU - Schalko, J.

AU - Dehm, Gerhard

PY - 2011

Y1 - 2011

M3 - Article

SP - 729

EP - 734

JO - International journal of materials research : IJMR ; Zeitschrift für Metallkunde

JF - International journal of materials research : IJMR ; Zeitschrift für Metallkunde

SN - 1862-5282

ER -