Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
Research output: Contribution to journal › Article › Research › peer-review
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| Translated title of the contribution | Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide |
|---|---|
| Original language | English |
| Pages (from-to) | 729-734 |
| Journal | International journal of materials research : IJMR ; Zeitschrift für Metallkunde |
| Publication status | Published - 2011 |
