Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
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Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide. / Cordill, Megan; Taylor, Aidan; Schalko, J. et al.
in: International journal of materials research : IJMR ; Zeitschrift für Metallkunde, 2011, S. 729-734.
in: International journal of materials research : IJMR ; Zeitschrift für Metallkunde, 2011, S. 729-734.
Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
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Bibtex - Download
@article{77836a4f088144fdad5de6aba2ec21ec,
title = "Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide",
author = "Megan Cordill and Aidan Taylor and J. Schalko and Gerhard Dehm",
year = "2011",
language = "English",
pages = "729--734",
journal = "International journal of materials research : IJMR ; Zeitschrift f{\"u}r Metallkunde",
issn = "1862-5282",
publisher = "Carl Hanser Verlag GmbH & Co. KG",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
AU - Cordill, Megan
AU - Taylor, Aidan
AU - Schalko, J.
AU - Dehm, Gerhard
PY - 2011
Y1 - 2011
M3 - Article
SP - 729
EP - 734
JO - International journal of materials research : IJMR ; Zeitschrift für Metallkunde
JF - International journal of materials research : IJMR ; Zeitschrift für Metallkunde
SN - 1862-5282
ER -
