Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis

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Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis. / Bigl, Stephan; Wurster, Stefan; Cordill, Megan J et al.
2016. 27th Colloquium on Fatigue Mechanisms, Wien, Austria.

Research output: Contribution to conferencePresentationResearch

Bibtex - Download

@conference{05f486002ea34d70b5925aa591c31681,
title = "Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis",
author = "Stephan Bigl and Stefan Wurster and Cordill, {Megan J} and Daniel Kiener",
year = "2016",
month = mar,
day = "22",
language = "English",
note = "27th Colloquium on Fatigue Mechanisms ; Conference date: 22-03-2016 Through 22-03-2016",

}

RIS (suitable for import to EndNote) - Download

TY - CONF

T1 - Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis

AU - Bigl, Stephan

AU - Wurster, Stefan

AU - Cordill, Megan J

AU - Kiener, Daniel

PY - 2016/3/22

Y1 - 2016/3/22

M3 - Presentation

T2 - 27th Colloquium on Fatigue Mechanisms

Y2 - 22 March 2016 through 22 March 2016

ER -