Influence of extreme thermal cycling on metal-polymer interfaces
Research output: Contribution to journal › Article › Research › peer-review
Standard
Influence of extreme thermal cycling on metal-polymer interfaces. / Putz, Barbara; Völker, Bernhard; Semprimoschnig, Christopher et al.
In: Microelectronic engineering, Vol. 167.2017, No. 5 January, 05.01.2017, p. 17-22.
In: Microelectronic engineering, Vol. 167.2017, No. 5 January, 05.01.2017, p. 17-22.
Research output: Contribution to journal › Article › Research › peer-review
Harvard
Putz, B, Völker, B, Semprimoschnig, C & Cordill, MJ 2017, 'Influence of extreme thermal cycling on metal-polymer interfaces', Microelectronic engineering, vol. 167.2017, no. 5 January, pp. 17-22. https://doi.org/10.1016/j.mee.2016.10.012
APA
Putz, B., Völker, B., Semprimoschnig, C., & Cordill, M. J. (2017). Influence of extreme thermal cycling on metal-polymer interfaces. Microelectronic engineering, 167.2017(5 January), 17-22. https://doi.org/10.1016/j.mee.2016.10.012
Vancouver
Putz B, Völker B, Semprimoschnig C, Cordill MJ. Influence of extreme thermal cycling on metal-polymer interfaces. Microelectronic engineering. 2017 Jan 5;167.2017(5 January):17-22. Epub 2016 Oct 18. doi: 10.1016/j.mee.2016.10.012
Author
Bibtex - Download
@article{8876f14cd4a6407cbae2a6df70800c77,
title = "Influence of extreme thermal cycling on metal-polymer interfaces",
keywords = "Adhesion, Buckling, Polymer, Thermal cycling, Thin film",
author = "Barbara Putz and Bernhard V{\"o}lker and Christopher Semprimoschnig and Cordill, {Megan J.}",
year = "2017",
month = jan,
day = "5",
doi = "10.1016/j.mee.2016.10.012",
language = "English",
volume = "167.2017",
pages = "17--22",
journal = "Microelectronic engineering",
issn = "0167-9317",
publisher = "Elsevier",
number = "5 January",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Influence of extreme thermal cycling on metal-polymer interfaces
AU - Putz, Barbara
AU - Völker, Bernhard
AU - Semprimoschnig, Christopher
AU - Cordill, Megan J.
PY - 2017/1/5
Y1 - 2017/1/5
KW - Adhesion
KW - Buckling
KW - Polymer
KW - Thermal cycling
KW - Thin film
UR - http://www.scopus.com/inward/record.url?scp=84992386994&partnerID=8YFLogxK
U2 - 10.1016/j.mee.2016.10.012
DO - 10.1016/j.mee.2016.10.012
M3 - Article
AN - SCOPUS:84992386994
VL - 167.2017
SP - 17
EP - 22
JO - Microelectronic engineering
JF - Microelectronic engineering
SN - 0167-9317
IS - 5 January
ER -
