Influence of extreme thermal cycling on metal-polymer interfaces

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Influence of extreme thermal cycling on metal-polymer interfaces. / Putz, Barbara; Völker, Bernhard; Semprimoschnig, Christopher et al.
in: Microelectronic engineering, Jahrgang 167.2017, Nr. 5 January, 05.01.2017, S. 17-22.

Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

Harvard

Putz, B, Völker, B, Semprimoschnig, C & Cordill, MJ 2017, 'Influence of extreme thermal cycling on metal-polymer interfaces', Microelectronic engineering, Jg. 167.2017, Nr. 5 January, S. 17-22. https://doi.org/10.1016/j.mee.2016.10.012

APA

Putz, B., Völker, B., Semprimoschnig, C., & Cordill, M. J. (2017). Influence of extreme thermal cycling on metal-polymer interfaces. Microelectronic engineering, 167.2017(5 January), 17-22. https://doi.org/10.1016/j.mee.2016.10.012

Vancouver

Putz B, Völker B, Semprimoschnig C, Cordill MJ. Influence of extreme thermal cycling on metal-polymer interfaces. Microelectronic engineering. 2017 Jan 5;167.2017(5 January):17-22. Epub 2016 Okt 18. doi: 10.1016/j.mee.2016.10.012

Author

Putz, Barbara ; Völker, Bernhard ; Semprimoschnig, Christopher et al. / Influence of extreme thermal cycling on metal-polymer interfaces. in: Microelectronic engineering. 2017 ; Jahrgang 167.2017, Nr. 5 January. S. 17-22.

Bibtex - Download

@article{8876f14cd4a6407cbae2a6df70800c77,
title = "Influence of extreme thermal cycling on metal-polymer interfaces",
keywords = "Adhesion, Buckling, Polymer, Thermal cycling, Thin film",
author = "Barbara Putz and Bernhard V{\"o}lker and Christopher Semprimoschnig and Cordill, {Megan J.}",
year = "2017",
month = jan,
day = "5",
doi = "10.1016/j.mee.2016.10.012",
language = "English",
volume = "167.2017",
pages = "17--22",
journal = "Microelectronic engineering",
issn = "0167-9317",
publisher = "Elsevier",
number = "5 January",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Influence of extreme thermal cycling on metal-polymer interfaces

AU - Putz, Barbara

AU - Völker, Bernhard

AU - Semprimoschnig, Christopher

AU - Cordill, Megan J.

PY - 2017/1/5

Y1 - 2017/1/5

KW - Adhesion

KW - Buckling

KW - Polymer

KW - Thermal cycling

KW - Thin film

UR - http://www.scopus.com/inward/record.url?scp=84992386994&partnerID=8YFLogxK

U2 - 10.1016/j.mee.2016.10.012

DO - 10.1016/j.mee.2016.10.012

M3 - Article

AN - SCOPUS:84992386994

VL - 167.2017

SP - 17

EP - 22

JO - Microelectronic engineering

JF - Microelectronic engineering

SN - 0167-9317

IS - 5 January

ER -

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