Influence of cooling rate and annealing on the DSC Tg of an epoxy resin
Research output: Contribution to journal › Article › Research › peer-review
Authors
Organisational units
External Organisational units
- AT and S AG
Details
| Original language | English |
|---|---|
| Pages (from-to) | 396-400 |
| Number of pages | 5 |
| Journal | Microelectronics Reliability |
| Volume | 78.2017 |
| Issue number | November |
| DOIs | |
| Publication status | E-pub ahead of print - 27 Jul 2017 |
