Influence of cooling rate and annealing on the DSC Tg of an epoxy resin

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Influence of cooling rate and annealing on the DSC Tg of an epoxy resin. / Tao, Qi; Pinter, Gerald; Krivec, Thomas.
In: Microelectronics Reliability, Vol. 78.2017, No. November, 27.07.2017, p. 396-400.

Research output: Contribution to journal › Article › Research › peer-review

Harvard

Tao, Q, Pinter, G & Krivec, T 2017, 'Influence of cooling rate and annealing on the DSC Tg of an epoxy resin', Microelectronics Reliability, vol. 78.2017, no. November, pp. 396-400. https://doi.org/10.1016/j.microrel.2017.07.088

APA

Tao, Q., Pinter, G., & Krivec, T. (2017). Influence of cooling rate and annealing on the DSC Tg of an epoxy resin. Microelectronics Reliability, 78.2017(November), 396-400. Advance online publication. https://doi.org/10.1016/j.microrel.2017.07.088

Vancouver

Tao Q, Pinter G, Krivec T. Influence of cooling rate and annealing on the DSC Tg of an epoxy resin. Microelectronics Reliability. 2017 Jul 27;78.2017(November):396-400. Epub 2017 Jul 27. doi: 10.1016/j.microrel.2017.07.088

Author

Tao, Qi ; Pinter, Gerald ; Krivec, Thomas. / Influence of cooling rate and annealing on the DSC Tg of an epoxy resin. In: Microelectronics Reliability. 2017 ; Vol. 78.2017, No. November. pp. 396-400.

Bibtex - Download

@article{de6c1654ee1e4acc99462d8adf72eb97,
title = "Influence of cooling rate and annealing on the DSC Tg of an epoxy resin",
keywords = "Annealing, Cooling rate, Curing pressure, Endothermic peak, Epoxy resin, Glass transition",
author = "Qi Tao and Gerald Pinter and Thomas Krivec",
year = "2017",
month = jul,
day = "27",
doi = "10.1016/j.microrel.2017.07.088",
language = "English",
volume = "78.2017",
pages = "396--400",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Elsevier",
number = "November",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Influence of cooling rate and annealing on the DSC Tg of an epoxy resin

AU - Tao, Qi

AU - Pinter, Gerald

AU - Krivec, Thomas

PY - 2017/7/27

Y1 - 2017/7/27

KW - Annealing

KW - Cooling rate

KW - Curing pressure

KW - Endothermic peak

KW - Epoxy resin

KW - Glass transition

UR - http://www.scopus.com/inward/record.url?scp=85026224896&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2017.07.088

DO - 10.1016/j.microrel.2017.07.088

M3 - Article

AN - SCOPUS:85026224896

VL - 78.2017

SP - 396

EP - 400

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

IS - November

ER -

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