Fracture mechanics of thin film systems on the sub-micron scale
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 2015. 7103088.
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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TY - GEN
T1 - Fracture mechanics of thin film systems on the sub-micron scale
AU - Kozic, Darjan
AU - Treml, Ruth
AU - Schongrundner, Ronald
AU - Brunner, Roland
AU - Kiener, Daniel
AU - Zechner, Johannes
AU - Antretter, Thomas
AU - Ganser, Hans Peter
PY - 2015/5/6
Y1 - 2015/5/6
UR - http://www.scopus.com/inward/record.url?scp=84944810041&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2015.7103088
DO - 10.1109/EuroSimE.2015.7103088
M3 - Conference contribution
AN - SCOPUS:84944810041
SN - 9781479999507
BT - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
PB - Institute of Electrical and Electronics Engineers
T2 - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
Y2 - 19 April 2015 through 22 April 2015
ER -