Fracture mechanics of thin film systems on the sub-micron scale

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Standard

Fracture mechanics of thin film systems on the sub-micron scale. / Kozic, Darjan; Treml, Ruth; Schongrundner, Ronald et al.
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 2015. 7103088.

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Harvard

Kozic, D, Treml, R, Schongrundner, R, Brunner, R, Kiener, D, Zechner, J, Antretter, T & Ganser, HP 2015, Fracture mechanics of thin film systems on the sub-micron scale. in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015., 7103088, Institute of Electrical and Electronics Engineers, 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Budapest, Ungarn, 19/04/15. https://doi.org/10.1109/EuroSimE.2015.7103088

APA

Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T., & Ganser, H. P. (2015). Fracture mechanics of thin film systems on the sub-micron scale. In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 Artikel 7103088 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE.2015.7103088

Vancouver

Kozic D, Treml R, Schongrundner R, Brunner R, Kiener D, Zechner J et al. Fracture mechanics of thin film systems on the sub-micron scale. in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers. 2015. 7103088 doi: 10.1109/EuroSimE.2015.7103088

Author

Kozic, Darjan ; Treml, Ruth ; Schongrundner, Ronald et al. / Fracture mechanics of thin film systems on the sub-micron scale. 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 2015.

Bibtex - Download

@inproceedings{cc8103515a5f4a8bbc4df8f553d22bfa,
title = "Fracture mechanics of thin film systems on the sub-micron scale",
author = "Darjan Kozic and Ruth Treml and Ronald Schongrundner and Roland Brunner and Daniel Kiener and Johannes Zechner and Thomas Antretter and Ganser, {Hans Peter}",
year = "2015",
month = may,
day = "6",
doi = "10.1109/EuroSimE.2015.7103088",
language = "English",
isbn = "9781479999507",
booktitle = "2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",
note = "2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 ; Conference date: 19-04-2015 Through 22-04-2015",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Fracture mechanics of thin film systems on the sub-micron scale

AU - Kozic, Darjan

AU - Treml, Ruth

AU - Schongrundner, Ronald

AU - Brunner, Roland

AU - Kiener, Daniel

AU - Zechner, Johannes

AU - Antretter, Thomas

AU - Ganser, Hans Peter

PY - 2015/5/6

Y1 - 2015/5/6

UR - http://www.scopus.com/inward/record.url?scp=84944810041&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE.2015.7103088

DO - 10.1109/EuroSimE.2015.7103088

M3 - Conference contribution

AN - SCOPUS:84944810041

SN - 9781479999507

BT - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015

PB - Institute of Electrical and Electronics Engineers

T2 - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015

Y2 - 19 April 2015 through 22 April 2015

ER -

Beziehungsdiagramm anzeigen

360 Link

Zeitschriften in BUGL

Vom selben Autor

Mehr zeigen