Fracture and Material Behavior of Thin Film composites
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Standard
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers, 2016. p. 1-6.
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Harvard
APA
Vancouver
Author
Bibtex - Download
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Fracture and Material Behavior of Thin Film composites
AU - Kozic, Darjan
AU - Konetschnik, Ruth
AU - Maier-Kiener, Verena
AU - Schöngrundner, Ronald
AU - Brunner, Roland
AU - Kiener, Daniel
AU - Antretter, Thomas
AU - Gänser, Hans-Peter
PY - 2016
Y1 - 2016
U2 - 10.1109/EuroSimE.2016.7463326
DO - 10.1109/EuroSimE.2016.7463326
M3 - Conference contribution
SP - 1
EP - 6
BT - 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
PB - Institute of Electrical and Electronics Engineers
T2 - 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Y2 - 17 April 2016 through 20 April 2016
ER -