Fracture and Material Behavior of Thin Film composites

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Fracture and Material Behavior of Thin Film composites. / Kozic, Darjan; Konetschnik, Ruth; Maier-Kiener, Verena et al.
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers, 2016. S. 1-6.

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Harvard

Kozic, D, Konetschnik, R, Maier-Kiener, V, Schöngrundner, R, Brunner, R, Kiener, D, Antretter, T & Gänser, H-P 2016, Fracture and Material Behavior of Thin Film composites. in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers, S. 1-6, 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Montpellier, Frankreich, 17/04/16. https://doi.org/10.1109/EuroSimE.2016.7463326

APA

Kozic, D., Konetschnik, R., Maier-Kiener, V., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T., & Gänser, H.-P. (2016). Fracture and Material Behavior of Thin Film composites. In 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (S. 1-6). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE.2016.7463326

Vancouver

Kozic D, Konetschnik R, Maier-Kiener V, Schöngrundner R, Brunner R, Kiener D et al. Fracture and Material Behavior of Thin Film composites. in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers. 2016. S. 1-6 doi: 10.1109/EuroSimE.2016.7463326

Author

Kozic, Darjan ; Konetschnik, Ruth ; Maier-Kiener, Verena et al. / Fracture and Material Behavior of Thin Film composites. 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers, 2016. S. 1-6

Bibtex - Download

@inproceedings{3266d803318c422b8006a2f8e2dcd3ed,
title = "Fracture and Material Behavior of Thin Film composites",
author = "Darjan Kozic and Ruth Konetschnik and Verena Maier-Kiener and Ronald Sch{\"o}ngrundner and Roland Brunner and Daniel Kiener and Thomas Antretter and Hans-Peter G{\"a}nser",
year = "2016",
doi = "10.1109/EuroSimE.2016.7463326",
language = "English",
pages = "1--6",
booktitle = "2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",
note = "17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 17-04-2016 Through 20-04-2016",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Fracture and Material Behavior of Thin Film composites

AU - Kozic, Darjan

AU - Konetschnik, Ruth

AU - Maier-Kiener, Verena

AU - Schöngrundner, Ronald

AU - Brunner, Roland

AU - Kiener, Daniel

AU - Antretter, Thomas

AU - Gänser, Hans-Peter

PY - 2016

Y1 - 2016

U2 - 10.1109/EuroSimE.2016.7463326

DO - 10.1109/EuroSimE.2016.7463326

M3 - Conference contribution

SP - 1

EP - 6

BT - 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

PB - Institute of Electrical and Electronics Engineers

T2 - 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Y2 - 17 April 2016 through 20 April 2016

ER -

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