Determination of cyclic mechanical properties of thin copper layers for PCB applications
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Standard
Determination of cyclic mechanical properties of thin copper layers for PCB applications. / Fellner, Klaus; Fuchs, Peter F.; Antretter, Thomas et al.
Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. 2014. p. 1-8.
Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. 2014. p. 1-8.
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Harvard
Fellner, K, Fuchs, PF, Antretter, T, Pinter, G & Schöngrundner, R 2014, Determination of cyclic mechanical properties of thin copper layers for PCB applications. in Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. pp. 1-8.
APA
Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G., & Schöngrundner, R. (2014). Determination of cyclic mechanical properties of thin copper layers for PCB applications. In Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (pp. 1-8)
Vancouver
Fellner K, Fuchs PF, Antretter T, Pinter G, Schöngrundner R. Determination of cyclic mechanical properties of thin copper layers for PCB applications. In Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. 2014. p. 1-8
Author
Bibtex - Download
@inproceedings{e86b14ced3c94d66b120b9cd8b21fdf9,
title = "Determination of cyclic mechanical properties of thin copper layers for PCB applications",
author = "Klaus Fellner and Fuchs, {Peter F.} and Thomas Antretter and Gerald Pinter and Ronald Sch{\"o}ngrundner",
year = "2014",
language = "English",
isbn = "978-1-4799-4791-1",
pages = "1--8",
booktitle = "Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Determination of cyclic mechanical properties of thin copper layers for PCB applications
AU - Fellner, Klaus
AU - Fuchs, Peter F.
AU - Antretter, Thomas
AU - Pinter, Gerald
AU - Schöngrundner, Ronald
PY - 2014
Y1 - 2014
M3 - Conference contribution
SN - 978-1-4799-4791-1
SP - 1
EP - 8
BT - Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
ER -
