Bonding at copper–alumina interfaces established by different surface treatments: a critical review
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| Translated title of the contribution | Bonding at copper–alumina interfaces established by different surface treatments: a critical review |
|---|---|
| Original language | English |
| Pages (from-to) | 5161-5168 |
| Journal | Journal of materials science |
| Volume | 41 |
| DOIs | |
| Publication status | Published - 2006 |
