Bonding at copper–alumina interfaces established by different surface treatments: a critical review

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Bonding at copper–alumina interfaces established by different surface treatments: a critical review. / Scheu, Christina; Gao, M.; Oh, S.H. et al.
In: Journal of materials science, Vol. 41, 2006, p. 5161-5168.

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@article{9509e478da8b4be3b2de2844d39c7392,
title = "Bonding at copper–alumina interfaces established by different surface treatments: a critical review",
author = "Christina Scheu and M. Gao and S.H. Oh and Gerhard Dehm and S. Klein and A.P. Tomsia and M. R{\"u}hle",
year = "2006",
doi = "10.1007/s10853-006-0073-0",
language = "English",
volume = "41",
pages = "5161--5168",
journal = "Journal of materials science",
issn = "0022-2461",
publisher = "Springer Netherlands",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Bonding at copper–alumina interfaces established by different surface treatments: a critical review

AU - Scheu, Christina

AU - Gao, M.

AU - Oh, S.H.

AU - Dehm, Gerhard

AU - Klein, S.

AU - Tomsia, A.P.

AU - Rühle, M.

PY - 2006

Y1 - 2006

U2 - 10.1007/s10853-006-0073-0

DO - 10.1007/s10853-006-0073-0

M3 - Article

VL - 41

SP - 5161

EP - 5168

JO - Journal of materials science

JF - Journal of materials science

SN - 0022-2461

ER -