Adhesion measurements of printed circuit boards using four point bending

Research output: Contribution to conferencePosterResearchpeer-review

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Adhesion measurements of printed circuit boards using four point bending. / Cordill, Megan.
2013. Poster session presented at EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spain.

Research output: Contribution to conferencePosterResearchpeer-review

Harvard

Cordill, M 2013, 'Adhesion measurements of printed circuit boards using four point bending', EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spain, 8/09/13.

APA

Cordill, M. (2013). Adhesion measurements of printed circuit boards using four point bending. Poster session presented at EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spain.

Vancouver

Cordill M. Adhesion measurements of printed circuit boards using four point bending. 2013. Poster session presented at EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spain.

Author

Cordill, Megan. / Adhesion measurements of printed circuit boards using four point bending. Poster session presented at EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spain.

Bibtex - Download

@conference{215ace026ee64c52808e14655d8602f4,
title = "Adhesion measurements of printed circuit boards using four point bending",
author = "Megan Cordill",
year = "2013",
language = "English",
note = "EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials ; Conference date: 08-09-2013",

}

RIS (suitable for import to EndNote) - Download

TY - CONF

T1 - Adhesion measurements of printed circuit boards using four point bending

AU - Cordill, Megan

PY - 2013

Y1 - 2013

M3 - Poster

T2 - EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials

Y2 - 8 September 2013

ER -