Adhesion measurements of printed circuit boards using four point bending
Research output: Contribution to conference › Poster › Research › peer-review
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Adhesion measurements of printed circuit boards using four point bending. / Cordill, Megan.
2013. Poster session presented at EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spain.
2013. Poster session presented at EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spain.
Research output: Contribution to conference › Poster › Research › peer-review
Harvard
Cordill, M 2013, 'Adhesion measurements of printed circuit boards using four point bending', EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spain, 8/09/13.
APA
Cordill, M. (2013). Adhesion measurements of printed circuit boards using four point bending. Poster session presented at EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spain.
Vancouver
Cordill M. Adhesion measurements of printed circuit boards using four point bending. 2013. Poster session presented at EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spain.
Author
Bibtex - Download
@conference{215ace026ee64c52808e14655d8602f4,
title = "Adhesion measurements of printed circuit boards using four point bending",
author = "Megan Cordill",
year = "2013",
language = "English",
note = "EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials ; Conference date: 08-09-2013",
}
RIS (suitable for import to EndNote) - Download
TY - CONF
T1 - Adhesion measurements of printed circuit boards using four point bending
AU - Cordill, Megan
PY - 2013
Y1 - 2013
M3 - Poster
T2 - EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials
Y2 - 8 September 2013
ER -
