Adhesion measurements of printed circuit boards using four point bending
Publikationen: Konferenzbeitrag › Poster › Forschung › (peer-reviewed)
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Adhesion measurements of printed circuit boards using four point bending. / Cordill, Megan.
2013. Postersitzung präsentiert bei EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spanien.
2013. Postersitzung präsentiert bei EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spanien.
Publikationen: Konferenzbeitrag › Poster › Forschung › (peer-reviewed)
Harvard
Cordill, M 2013, 'Adhesion measurements of printed circuit boards using four point bending', EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spanien, 8/09/13.
APA
Cordill, M. (2013). Adhesion measurements of printed circuit boards using four point bending. Postersitzung präsentiert bei EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spanien.
Vancouver
Cordill M. Adhesion measurements of printed circuit boards using four point bending. 2013. Postersitzung präsentiert bei EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials, Sevilla, Spanien.
Author
Bibtex - Download
@conference{215ace026ee64c52808e14655d8602f4,
title = "Adhesion measurements of printed circuit boards using four point bending",
author = "Megan Cordill",
year = "2013",
language = "English",
note = "EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials ; Conference date: 08-09-2013",
}
RIS (suitable for import to EndNote) - Download
TY - CONF
T1 - Adhesion measurements of printed circuit boards using four point bending
AU - Cordill, Megan
PY - 2013
Y1 - 2013
M3 - Poster
T2 - EUROMAT 2013, Symposium D2-III: Interface failure in thin film structure and composite materials
Y2 - 8 September 2013
ER -
