Tobias Ziegelwanger
11 - 13 out of 13Page size: 10
Research output
- Published
Local gradients of microstructure and residual stresses in Si device sidewalls separated by laser dicing
Ziegelwanger, T., Meindlhumer, M., Todt, J., Reisinger, M., Matoy, K. & Keckes, J., 24 Apr 2023.Research output: Contribution to conference › Poster › Research
- Published
Backside metallization affects residual stress and bending strength of the recast layer in laser-diced Si
Ziegelwanger, T., Reisinger, M., Matoy, K., Medjahed, A. A., Zalesak, J., Gruber, M., Meindlhumer, M. & Keckes, J., Oct 2024, In: Materials Science in Semiconductor Processing. 181, 108579.Research output: Contribution to journal › Article › Research › peer-review
- Published
20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates
Ziegelwanger, T., Reisinger, M., Vedad, B., Hlushko, K., Van Petegem, S., Todt, J., Meindlhumer, M. & Keckes, J., 31 Jan 2025, In: Materials and Design. 251.2025, March, 9 p., 113664.Research output: Contribution to journal › Article › Research › peer-review
