Thomas Antretter
Research output
- 2014
- Published
Festigkeitsskalierung nach Weibull
Pittino, G., Tichy, R., Galler, R., Antretter, T., Ecker, W., Gimpel, M. & Kargl, H., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Method development for the cyclic characterization of thin copper layers for PCB applications
Fellner, K., Fuchs, P. F., Pinter, G., Antretter, T. & Krivec, T., 2014, In: Circuit World. 40, p. 53-60Research output: Contribution to journal › Article › Research › peer-review
- Published
Microwave absorption and its thermo-mechanical consequences in heterogeneous rocks
Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Microwave absorption and its thermo-mechanical consequences in heterogeneous rocks
Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2014, Geomechanics from Micro to Macro. p. 1545-1550Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Modelling of phase transformations and residual stress formation in hot-work tool steel components
Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2014, European Conference of Heat Treatment and 21st IFHTSE Congress. p. 285-292Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Residual Stress Investigations in Thin Film Systems: Experiment and Simulation
Kozic, D., Treml, R., Sartory, B., Schöngrundner, R., Kiener, D., Antretter, T., Gänser, H.-P. & Brunner, R., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation of the roller straightening process with respect to residual stresses and the curvature trend
Kaiser, R., Hatzenbichler, T., Buchmayr, B. & Antretter, T., 2014, International Conference on Residual Stresses 9 (ICRS 9). p. 456-463Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2013
- Published
Multi-physics simulation of the component attachment within embedding process
Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
An Efficient Algorithm for Modeling the Thermo-Mechanical Material Response of Havy Steel Plates during Accelerated Cooling
Eßl, W., Antretter, T. & Parteder, E., 2013, Key engineering materials. Vol. 554-557. p. 749-763 (Key engineering materials).Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research
