Thomas Antretter

Research output

  1. Published
  2. Published

    Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

    Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Crack arrest in thin metallic film stacks due to material- and residual stress inhomogeneities

    Kozic, D., Gänser, H.-P., Brunner, R., Kiener, D., Antretter, T. & Kolednik, O., 31 Dec 2018, In: Thin solid films. p. 14-22 9 p.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Coupled damage variable based on fracture locus: Prediction of ductile failure in a complex structure

    Baltic, S., Magnien, J., Gänser, H.-P., Antretter, T. & Hammer, R., 23 Oct 2020, In: International journal of solids and structures. 207.2020, December, p. 132-144 13 p.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    Coupled damage variable based on fracture locus: Modelling and calibration

    Baltic, S., Magnien, J., Gänser, H.-P., Antretter, T. & Hammer, R., 23 Nov 2019, In: International journal of plasticity. 126.2020, March, 24 p., 102623.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    Convergence tests - Influence of modelling on the dynamic vibration behaviour of coaches

    Böhler, E., Antretter, T., Magerl, F. & Rosenberger, M., 2012, Generation and Propagation of Sound in Solids and Fluids - Modern Analysis Methods in Acoustics. p. 1-9

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  7. Published

    Concepts for E-Assessments in STEM on the Example of Engineering Mechanics: How to Assess Complex EngineeringProblemsElectronically

    Orthaber, M., Stütz, D., Antretter, T. & Ebner, M., 26 Jun 2020, In: International journal emerging technologies in learning : iJET. 15.2020, 12, p. 136-152 17 p.

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published
  9. Published

    Comparison of Different Methods for Stress and Deflection Analysis in Embedded die Packages during the Assembly Process

    Macurova, K., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Apr 2015, In: Journal of Microelectronics and Electronic Packaging. 12.2015, 2, p. 80-85 6 p.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published

    Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

    Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution