Thomas Antretter
151 - 160 out of 236Page size: 10
Research output
- Published
Thermo-physical properties of selected hard rocks and their relation to microwave-assisted comminution
Hartlieb, P., Toifl, M., Kuchar, F., Meisels, R. & Antretter, T., 2016, In: Minerals engineering. 91.2016, p. 34 - 41 8 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Finite element analysis of arbitrarily complex electronics devices
Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T. & Tao, Q., 2016, Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. p. 497-500Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers
Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. G. & Novàk, P., 2018.Research output: Contribution to conference › Poster › Research
- Published
Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers
Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. G. & Novàk, P., 2018, EMAP 2018 Conference Proceedings. 4 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers
Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 Mar 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip
Gschwandl, M., Fuchs, P. F., Antretter, T., Pfost, M., Mitev, I., Tao, Q., Krivec, T., Schingale, A. & Decker, M., 2019, p. 1509-1514.Research output: Contribution to conference › Paper › peer-review
- Published
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- E-pub ahead of print
Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics
Gschwandl, M., Friedrich, B. E., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 4 May 2022, (E-pub ahead of print) In: Microelectronics Reliability. 133.2022, June, 9 p., 114537.Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Investigation of probable squat growth from initial surface cracks in rails using a three-dimensional rollover simulation
Gschwandl, T. J., Antretter, T., Künstner, D., Scheriau, S. & Daves, W., 29 Apr 2024, (E-pub ahead of print) In: Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit. 238.2024, 4, p. 406-413 8 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Experimental and Numerical Visualisation of Subsurface Rail Deformation in a Full-Scale Wheel–Rail Test Rig
Gschwandl, T. J., Weniger, T. M., Antretter, T., Künstner, D., Scheriau, S. & Daves, W., Jun 2023, In: Metals. 13.2023, 6, 18 p., 1089.Research output: Contribution to journal › Article › Research › peer-review
