Stephan Bigl
(Former)
1 - 10 out of 12Page size: 10
Research output
- Published
Site Specific Microstructural Evolution of Thermo-mechanically Fatigued Copper Films
Bigl, S., Wurster, S., Cordill, M. J. & Kiener, D., 18 Feb 2015, In: Berg- und hüttenmännische Monatshefte : BHM. 160, 5, p. 235-239 5 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
Bigl, S., Wurster, S., Cordill, M. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612.2016, 1 August, p. 153-164 12 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Correlative microstructure and topography informed nanoindentation of copper films
Bigl, S., Schöberl, T., Wurster, S., Cordill, M. & Kiener, D., 25 Dec 2016, In: Surface & coatings technology. 308.2016, 25 December, p. 404-413 10 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis
Bigl, S., Wurster, S., Cordill, M. J. & Kiener, D., 22 Mar 2016.Research output: Contribution to conference › Presentation › Research
- Published
Microstructural and mechanical investigations of thermo-mechanically loaded Cu films using a thermal laser cycling device
Bigl, S., Wurster, S., Cordill, M. J. & Kiener, D., 2016.Research output: Contribution to conference › Poster › Research
- Published
Structural changes in amorphous SiO2 films revealed by in-situ stress measurements up to 1000C
Bigl, S. & Cordill, M., 2016.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Advanced Characterization of thermo-mechanical fatigue mechanisms for semiconductor metallizations
Bigl, S., Wurster, S., Schöberl, T., Cordill, M. & Kiener, D., 2016.Research output: Contribution to conference › Presentation › Research › peer-review
- Published
Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue
Bigl, S., Trost, C. O. W., Wurster, S., Cordill, M. J. & Kiener, D., 1 Jun 2017, In: Journal of materials research (JMR). 32.2017, 11, p. 2022-2034 13 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Thermo-mechanical behaviour of thick copper metallizations for power electronics
Bigl, S., 2017Research output: Thesis › Doctoral Thesis
- Published
Tracking of Grain Boundary Movement Due to (Thermo-) Mechanical Deformation
Wurster, S., Bigl, S., Renk, O., Cordill, M. J., Hohenwarter, A., Pippan, R. & Kiener, D., 24 Nov 2015.Research output: Contribution to conference › Presentation › Research
