Daniel Kiener
Research output
- Published
Fabrication and thermo-mechanical behavior of ultra-fine porous copper
Kreuzeder, M., Abad, M. D., Primorac, M.-M., Hosemann, P., Maier, V. & Kiener, D., 2015, In: Journal of materials science. 50, p. 634-643Research output: Contribution to journal › Article › Research › peer-review
- Published
Residual Stress Investigations in Thin Film Systems: Experiment and Simulation
Kozic, D., Treml, R., Sartory, B., Schöngrundner, R., Kiener, D., Antretter, T., Gänser, H.-P. & Brunner, R., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method
Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H.-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Institute of Electrical and Electronics Engineers, 6813785Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Fracture mechanics of thin film systems on the sub-micron scale
Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Fracture and Material Behavior of Thin Film composites
Kozic, D., Konetschnik, R., Maier-Kiener, V., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H.-P., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers, p. 1-6 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- E-pub ahead of print
Extracting flow curves from nano-sized metal layers in thin film systems
Kozic, D., Maier-Kiener, V., Konetschnik, R., Gänser, H.-P., Antretter, T., Brunner, R. & Kiener, D., 7 Dec 2016, (E-pub ahead of print) In: Scripta materialia. 130.2017, 15 March, p. 143-147 5 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Crack arrest in thin metallic film stacks due to material- and residual stress inhomogeneities
Kozic, D., Gänser, H.-P., Brunner, R., Kiener, D., Antretter, T. & Kolednik, O., 31 Dec 2018, In: Thin solid films. p. 14-22 9 p.Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Miniaturized fracture experiments to determine the toughness of individual films in a multilayer system
Konetschnik, R., Kozic, D., Schöngrundner, R., Kolednik, O., Gänser, H.-P., Brunner, R. & Kiener, D., 25 Jan 2016, (E-pub ahead of print) In: Extreme Mechanics Letters. 8.2016, September, p. 235-244 10 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Miniaturized Fracture Concepts for Stressed Multi-layer Thin Film Systems
Konetschnik, R., Kozic, D., Schöngrundner, R., Ganser, H. P., Brunner, R. & Kiener, D., 2016.Research output: Contribution to conference › Presentation › Research
- Published
Residual Stresses and Fracture Toughness in Multi-layered Thin Film Systems
Konetschnik, R., Kozic, D., Schöngrundner, R., Ganser, H. P., Brunner, R. & Kiener, D., 15 Mar 2016.Research output: Contribution to conference › Presentation › Research › peer-review
