Christoph Kirchlechner

(Former)

Research output

  1. Published

    Ductile film delamination from compliant substrates using hard overlayers

    Cordill, M. J., Marx, V. M. & Kirchlechner, C., 2014, In: Thin solid films. 571, p. 302-307

    Research output: Contribution to journalArticleResearchpeer-review

  2. Published

    Dislocation storage in single slip oriented Cu micro-tensile samples: New insights by X-ray microdiffraction

    Kirchlechner, C., Kiener, D., Motz, C., Labat, S., Vaxelaire, N., Perroud, O., Micha, J.-S., Ulrich, O., Thomas, O., Dehm, G. & Keckes, J., 2011, In: Philosophical magazine. 91, p. 1256-1264

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published
  4. Published

    Direct observation of crack arrest after bridge notch failure: A strategy to increase statistics and reduce FIB-artifacts in micro-cantilever testing

    Zhang, Y., Bartosik, M., Brinckmann, S., Lee, S. & Kirchlechner, C., Sept 2023, In: Materials and Design. 233.2023, September, 7 p., 112188.

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary

    Imrich, P., Kirchlechner, C., Motz, C. & Dehm, G., 2014, In: Acta materialia. 73, p. 240-250

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    Deformation Mechanisms in Micron-Sized PST-TiAl Compression Samples: Experiment and Model

    Rester, M., Fischer, F. D., Kirchlechner, C., Schmölzer, T., Clemens, H. & Dehm, G., 2011, In: Acta materialia. 59, p. 3410-3421

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Deformation behavior of miniaturized copper bicrystals and corresponding dislocation boundary reactions

    Imrich, P. J., Kirchlechner, C., An, X., Zhang, Z. & Dehm, G., 2011.

    Research output: Contribution to conferencePosterResearchpeer-review

  8. Published

    Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction

    Wimmer, A. C., Heinz, W., Detzel, T., Robl, W., Nellessen, M., Kirchlechner, C. & Dehm, G., 2015, In: Acta materialia. 83, p. 460-469

    Research output: Contribution to journalArticleResearchpeer-review

  9. E-pub ahead of print

    Compressed Bi-crystal micropillars showing a sigmoidal deformation state – A computational study

    Toth, F., Kirchlechner, C., Fischer, F.-D., Dehm, G. & Rammerstorfer, F. G., 26 May 2017, (E-pub ahead of print) In: Materials science and engineering: A, Structural materials: properties, microstructure and processing. 700.2017, 17 July, p. 168-174 7 p.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior

    Du, C., Soeler, R., Völker, B., Matoy, K., Zechner, J., Langer, G., Reisinger, M., Todt, J., Kirchlechner, C. & Dehm, G., 1 Dec 2019, In: Materialia. 8.2019, 100503.

    Research output: Contribution to journalArticleResearchpeer-review