Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary

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Translated title of the contribution	Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary
Original language	English
Pages (from-to)	240-250
Journal	Acta materialia
Volume	73
DOIs	https://doi.org/10.1016/j.actamat.2014.04.022
Publication status	Published - 2014