Christoph Kirchlechner

(Former)

Research output

  1. Published

    X-ray diffraction analysis of three-dimensional residual stress fields reveals origins of thermal fatigue in uncoated and coated steel

    Kirchlechner, C., Martinschitz, K. J., Daniel, R., Mitterer, C., Donges, J., Rothkirch, A., Klaus, M., Genzel, C. & Keckes, J., 2010, In: Scripta materialia. 62, p. 774-777

    Research output: Contribution to journalArticleResearchpeer-review

  2. Published

    Advanced nanomechanics in the TEM: effects of thermal annealing on FIB prepared Cu samples

    Kiener, D., Zhang, Z., Sturm, S., Cazottes, S., Imrich, P. J., Kirchlechner, C. & Dehm, G., 2012, In: Philosophical magazine. 92, p. 3269-3289

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Electro-Mechanical Behaviorof Single and Multilayer Metal Thin Films on Polymer Substrates

    Jörg, T., Cordill, M., Franz, R., Kirchlechner, C., Winkler, J. & Mitterer, C., 2016.

    Research output: Contribution to conferencePresentationResearch

  4. Published

    Deformation behavior of miniaturized copper bicrystals and corresponding dislocation boundary reactions

    Imrich, P. J., Kirchlechner, C., An, X., Zhang, Z. & Dehm, G., 2011.

    Research output: Contribution to conferencePosterResearchpeer-review

  5. Published

    Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary

    Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 15 Apr 2015, In: Scripta materialia. 100, p. 94-97 4 p.

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    In Situ TEM Microcompression of Single and Bicrystalline Samples: Insights and Limitations

    Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 19 May 2015, In: JOM. 67, 8, p. 1704 1712 p.

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary

    Imrich, P., Kirchlechner, C., Motz, C. & Dehm, G., 2014, In: Acta materialia. 73, p. 240-250

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published

    Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain

    Glushko, O., Marx, V. M., Kirchlechner, C., Zizak, I. & Cordill, M. J., 2014, In: Thin solid films. 552, p. 141-145

    Research output: Contribution to journalArticleResearchpeer-review

  9. Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior

    Du, C., Soeler, R., Völker, B., Matoy, K., Zechner, J., Langer, G., Reisinger, M., Todt, J., Kirchlechner, C. & Dehm, G., 1 Dec 2019, In: Materialia. 8.2019, 100503.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published