Christoph Kirchlechner

(Former)

Research output

  1. Published
  2. Published

    Advanced nanomechanics in the TEM: effects of thermal annealing on FIB prepared Cu samples

    Kiener, D., Zhang, Z., Sturm, S., Cazottes, S., Imrich, P. J., Kirchlechner, C. & Dehm, G., 2012, In: Philosophical magazine. 92, p. 3269-3289

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Electro-Mechanical Behaviorof Single and Multilayer Metal Thin Films on Polymer Substrates

    Jörg, T., Cordill, M., Franz, R., Kirchlechner, C., Winkler, J. & Mitterer, C., 2016.

    Research output: Contribution to conferencePresentationResearch

  4. Published

    Deformation behavior of miniaturized copper bicrystals and corresponding dislocation boundary reactions

    Imrich, P. J., Kirchlechner, C., An, X., Zhang, Z. & Dehm, G., 2011.

    Research output: Contribution to conferencePosterResearchpeer-review

  5. Published

    Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary

    Imrich, P., Kirchlechner, C., Motz, C. & Dehm, G., 2014, In: Acta materialia. 73, p. 240-250

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published

    Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary

    Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 15 Apr 2015, In: Scripta materialia. 100, p. 94-97 4 p.

    Research output: Contribution to journalArticleResearchpeer-review

  7. Published

    In Situ TEM Microcompression of Single and Bicrystalline Samples: Insights and Limitations

    Imrich, P. J., Kirchlechner, C., Kiener, D. & Dehm, G., 19 May 2015, In: JOM. 67, 8, p. 1704 1712 p.

    Research output: Contribution to journalArticleResearchpeer-review

  8. Published

    Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain

    Glushko, O., Marx, V. M., Kirchlechner, C., Zizak, I. & Cordill, M. J., 2014, In: Thin solid films. 552, p. 141-145

    Research output: Contribution to journalArticleResearchpeer-review

  9. Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior

    Du, C., Soeler, R., Völker, B., Matoy, K., Zechner, J., Langer, G., Reisinger, M., Todt, J., Kirchlechner, C. & Dehm, G., 1 Dec 2019, In: Materialia. 8.2019, 100503.

    Research output: Contribution to journalArticleResearchpeer-review

  10. Published