Department Polymer Engineering and Science
Organisational unit: Departments and Institutes
391 - 400 out of 4,193Page size: 10
Research output
- Published
Ink Composition, kit, method of manufacturing a deformable conductor utilizing the ink composition, deformable conductor and electronic device comprising the
Thomas, G. (Inventor) & Krzysztof, K. K. (Inventor), 24 Feb 2021, IPC No. H05K 3/ 12 A I, Patent No. GB2586450, Priority date 12 Aug 2019, Priority No. GB20190011512Research output: Patent
- Published
Berechnungsmodell für Maddock- und Wendelscherteile in der Einschneckenplastifiziertechnologie
Thiel, H., 2007, 97 p.Research output: Thesis › Diploma Thesis
- Published
Neuentwicklung eines Tauchcomputers mit berührungssensitivem Display
Thallinger, F., 2015Research output: Thesis › Master's Thesis
- Published
Process simulation for digital light processing (DLP) based 3D printing
Thalhammer, A., Strohmeier, L., Pishvazadeh Moghaddam, H., Wolfberger, A. & Fuchs, P., 2021.Research output: Contribution to conference › Poster › Research
- Published
A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process
Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
A black-box optimization strategy for customizable global elastic deformation behavior of unit cell-based tri-anti-chiral metamaterials
Thalhamer, A., Fleisch, M., Schuecker, C., Fuchs, P. F., Schlögl, S. & Berer, M., Dec 2023, In: Advances in Engineering Software. 186.2023, December, 19 p., 103553.Research output: Contribution to journal › Article › Research › peer-review
- Published
Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
Thalhamer, A., Rossegger, E., Hasil, S., Hrbinič, K., Feigl, V., Pfost, M. & Fuchs, P. F., 2023.Research output: Contribution to conference › Poster › Research
- Published
Virtual Optimization of 3D Printed Structures with Tailored Mechanical and Functional Properties
Thalhamer, A., 2024Research output: Thesis › Doctoral Thesis
- Published
An optimization strategy for customizable global elastic deformation of unit cell-based metamaterials with variable material section discretization
Thalhamer, A., Fleisch, M., Schuecker, C., Fuchs, P. F., Schlögl, S. & Berer, M., 12 Nov 2024, In: Advances in Engineering Software. 199.2025, January, 17 p., 103817.Research output: Contribution to journal › Article › Research › peer-review
