Department Materials Science
Organisational unit: Departments and Institutes
Research output
- 2014
- Published
Residual Stress Investigations in Thin Film Systems: Experiment and Simulation
Kozic, D., Treml, R., Sartory, B., Schöngrundner, R., Kiener, D., Antretter, T., Gänser, H-P. & Brunner, R., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Revealing the precipitation of Al-alloys subjected to high pressure torsion
Li, J., Renk, O., Kutleša, P., Zhang, Z., Pippan, R. & Schumacher, P., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Reversible cyclic deformation mechanism of gold nanowires by twinning–detwinning transition evidenced from in situ TEM
Lee, S., Im, J., Yoo, Y., Bitzek, E., Kiener, D., Richter, G., Kim, B. & Oh, S. H., 2014, In: Nature Communications. 5, p. 1-10Research output: Contribution to journal › Article › Research › peer-review
- Published
Role of microstructure on the electro-mechanical behaviour of copper films on polyimide
Berger, J., 2014, 64 p.Research output: Thesis › Diploma Thesis
- Published
Sample tilt-free characterization of residual stress gradients in thin coatings using an in-plane arm-equipped laboratory X-ray diffractometer
Benediktovitch, A. I., Ulyanenkova, T., Keckes, J. & Ulyanenkov, A. P., 2014, In: Journal of applied crystallography. p. 1931-938Research output: Contribution to journal › Article › Research › peer-review
- Published
Seed layer stimulated growth of crystalline high Al containing (Al,Cr)2O3 coatings deposited by cathodic arc evaporation
Pohler, M., Franz, R., Ramm, J., Polcik, P. & Mitterer, C., 2014, In: Thin solid films. 550, p. 95-104Research output: Contribution to journal › Article › Research › peer-review
- Published
Self-adaptive lubrication mechanisms in hard coatings for different temperature regimes
Franz, R. & Mitterer, C., 2014.Research output: Contribution to conference › Presentation › Research › peer-review
- Published
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation of yield strength in Allvacspi® 718Plus™
Ahmadi, M. R., Whitmore, L., Povoden-Karadeniz, E., Stockinger, M., Falahati, A. & Kozeschnik, E., 2014, THERMEC 2013 Supplement. Trans Tech Publications, p. 7-12 6 p. (Advanced Materials Research; vol. 922).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Sputtered Si-containing low-friction carbon coatings for elevated temperatures
Jantschner, O., Field, S. K., Music, D., Terziyska, V., Schneider, J. M., Munnik, F., Zorn, K. & Mitterer, C., 2014, In: Tribology International. 77, p. 15-23Research output: Contribution to journal › Article › Research › peer-review
