Department Materials Science

Organisational unit: Departments and Institutes

Research output

  1. E-pub ahead of print

    Stress-strain Behavior and Microstructural Evolution of Ultra-High Carbon Fe-C-Cr-V-Mo Steel Subjected to Hot Deformation

    Wang, R., Zhang, W., Li, Y., Li, D., Kang, Y., Yang, X., Eckert, J. & Yan, Z., 5 Nov 2020, (E-pub ahead of print) In: Materials characterization. 2021, 110746, 110746.

    Research output: Contribution to journalArticleResearchpeer-review

  2. Published

    Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing

    Huang, R., Robl, W., Ceric, H., Detzel, T. & Dehm, G., 2010, In: IEEE transactions on device and materials reliability. 10, 1, p. 47-54

    Research output: Contribution to journalArticleResearchpeer-review

  3. Published

    Stress relaxation through thermal crack formation in CVD TiCN coatings grown on WC-Co with different Co contents

    Stylianou, R. P., Velic, D., Daves, W., Ecker, W., Stark, A., Schell, N., Tkadletz, M., Schalk, N., Czettl, C. & Mitterer, C., Jan 2020, In: International journal of refractory metals & hard materials. 86.2020, January, 9 p., 105102.

    Research output: Contribution to journalArticleResearchpeer-review

  4. Published

    Stress Factors and Absolute Residual Stresses in Thin Films Determined by the Combination of Curvature and sin2ψ Methods

    Martinschitz, K.-J., Eiper, E. & Keckes, J., 2006, In: Materials Science Forum . 524-525, p. 711-715

    Research output: Contribution to journalArticleResearchpeer-review

  5. Published

    Stress evolution in CrN/Cr coating systems during thermal straining

    Martinschitz, K. J., Daniel, R., Mitterer, C. & Keckes, J., 2008, In: Thin solid films. 516, p. 1972-1976

    Research output: Contribution to journalArticleResearchpeer-review

  6. Published
  7. Published

    Stress design of hard coatings

    Daniel, R., Keckes, J. & Mitterer, C., 2011, Proceeding of International Conference on Metallurgical Coatings and Thin Films. p. 55-55

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  8. Published
  9. Published
  10. Published

    Stress and Pressure within the Linearized-Augmented Plane-Wave Method

    Thonhauser, T., Draxl, C. & Singh, D. J., 2002, In: Solid state communications. 124, p. 275-275

    Research output: Contribution to journalArticleResearchpeer-review