Department Materials Science

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Research output

Published
Modification of wetting of copper (Cu) on carbon (C) by plasma treatment and molybdenum (Mo)interlayers
Eisenmenger-Sittner, C., Schrank, C., Neubauer, E., Eiper, E. & Keckes, J., 2006, In: Applied surface science. 252, p. 5343-5346
Research output: Contribution to journal › Article › Research › peer-review
Published
Residual stresses and size-strain phenomena in thermally cycled Cu layers on anisotropical SiO2(110) substrates
Eiper, E., Hafok, M., Eisenmenger-Sittner, C. & Keckes, J., 2004.
Research output: Contribution to conference › Poster › Research › peer-review
Published
Size effect in metallic thin films characterized by low-temperature X-ray diffraction
Eiper, E., Martinschitz, K. J., Dehm, G. & Keckes, J., 2006.
Research output: Contribution to conference › Poster › Research › peer-review
Published
Zukunftsfonds Land Steiermark, Projekt Nr. 119
Eiper, E., Keckes, J. & Pippan, R., 2006
Research output: Book/Report › Commissioned report › Transfer › peer-review
Published
Size-independent stresses in Al thin films thermally strained down to -100°C
Eiper, E., Keckes, J., Zizak, I., Cabie, M. & Dehm, G., 2007, In: Acta materialia. 55, p. 1941-1946
Research output: Contribution to journal › Article › Research › peer-review
Published
Thermally-induced stresses in thin aluminum layers grown on silicon
Eiper, E., Resel, R., Eisenmenger-Sittner, C., Hafok, M. & Keckes, J., 2004, In: Powder diffraction. p. 74-76
Research output: Contribution to journal › Article › Research › peer-review
Published
Anisotropic intrinsic and extrinsic stresses in gan thin film on LiAlO2 (100)
Eiper, E., Gerlach, J. W., Rauschenbach, B. & Keckes, J., 2004.
Research output: Contribution to conference › Poster › Research › peer-review
Published
Temperature dependence of residual stresses in thin films determined by the substrate
Eiper, E., Martinschitz, K.-J., Köstenbauer, H., Massl, S. & Keckes, J., 2006.
Research output: Contribution to conference › Poster › Research › peer-review
Published
Temperature dependence of residual stresses in thin films determined by the substrate curvatur method
Eiper, E., Martinschitz, K.-J., Köstenbauer, H., Massl, S. & Keckes, J., 2006.
Research output: Contribution to conference › Poster › Research › peer-review
Published
Size effect in metallic thin films characterized by low-temperature X-ray diffraction
Eiper, E., Martinschitz, K. J., Dehm, G. & Keckes, J., 2006.
Research output: Contribution to conference › Poster › Research › peer-review

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Research Portal

Department Materials Science

Research output

Modification of wetting of copper (Cu) on carbon (C) by plasma treatment and molybdenum (Mo)interlayers

Residual stresses and size-strain phenomena in thermally cycled Cu layers on anisotropical SiO2(110) substrates

Size effect in metallic thin films characterized by low-temperature X-ray diffraction

Zukunftsfonds Land Steiermark, Projekt Nr. 119

Size-independent stresses in Al thin films thermally strained down to -100°C

Thermally-induced stresses in thin aluminum layers grown on silicon

Anisotropic intrinsic and extrinsic stresses in gan thin film on LiAlO2 (100)

Temperature dependence of residual stresses in thin films determined by the substrate

Temperature dependence of residual stresses in thin films determined by the substrate curvatur method

Size effect in metallic thin films characterized by low-temperature X-ray diffraction

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