Chair of Materials Science and Testing of Polymers (210)
Organisational unit: Chair
Research output
- Published
Nano vs. recycling: a study of different fillers for thermosets
Feuchter, M., Kern, W. & Sieberer, M., Jul 2022, EPF European Polymer Congress - Book of Abstracts. 1 ed. Prag, p. 272Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Nano vs. recycling: a study of different fillers for thermosets
Feuchter, M., Sieberer, M. & Kern, W., Jun 2022.Research output: Contribution to conference › Poster › Research
- Published
BIOBASED STRETCH FILMS – THE FUTURE OF PACKAGING?
Feuchter, M., 2023, Polymer Meeting 15 - Book of Abstacts. p. 93 1 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Recycling of multilayer packaging film
Feuchter, M., 2023, Challenges, trends and solutions in developing and processing of recycled polymer materials.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Recycling of multilayer packaging film
Feuchter, M., Plevová, K., Medvid, V. & Brenn, G., 2023, 31st Leoben-Conference on Polymer Engineering and Science: Circular Thinking in Polymer Technology. p. 37-39Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Determination of hierarchical strains in intercalated clay-polypropylene nanocomposites
Feuchter, M., Maier, G. A., Pinter, G., Kracalik, M., Laske, S. & Langecker, G. R., 2008, Materials Research Society Symposium Proceedings.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads
Fellner, K., Fuchs, P. & Pinter, G., 2014, 13th Youth Symposium on Experimental Solid Mechanics. p. 29-32Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Method development for the cyclic characterization of thin copper layers for PCB applications
Fellner, K., Fuchs, P. F., Pinter, G., Antretter, T. & Krivec, T., 2014, In: Circuit World. 40, p. 53-60Research output: Contribution to journal › Article › Research › peer-review
- Published
Simulation des "Single Via Thermal Cycle Test" - Modellerstellung und Bestimmung der Materialeingangsparameter
Fellner, K., 2012Research output: Thesis › Master's Thesis
- Published
Bestimmung der Schadenstoleranz und der Ermüdungseigenschaften von kohlefaserverstärkten Epoxid-Laminaten
Felber, S., 2006, 107 p.Research output: Thesis › Diploma Thesis
