Thin solid films, 0040-6090
Journal
| ISSNs | 0040-6090 |
|---|
81 - 83 out of 83Page size: 10
Research output
- Published
Can micro-compression testing provide stress-strain data for thin films? A comparative study using Cu, VN, TiN and W coatings
Dehm, G., Wörgötter, H.-P., Cazottes, S., Purswani, J. M., Gall, D., Mitterer, C. & Kiener, D., 2009, In: Thin solid films. 518, p. 1517-1521Research output: Contribution to journal › Article › Research › peer-review
- Published
Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations
Bigl, S., Wurster, S., Cordill, M. & Kiener, D., 1 Aug 2016, In: Thin solid films. 612.2016, 1 August, p. 153-164 12 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films
Matoy, K., Schönherr, H., Detzel, T., Schöberl, T., Pippan, R., Motz, C. & Dehm, G., 2009, In: Thin solid films. 518, p. 247-256Research output: Contribution to journal › Article › Research › peer-review
