Institute of Electrical and Electronics Engineers

Herausgeber (Verlag): Verlag/Herausgebende InstitutionHerausgeber (Verlag)

Publikationen

  1. 2021
  2. Veröffentlicht

    A probabilistic approach for complete coverage path planning with low-cost systems

    Rottmann, N., Denz, R., Bruder, R. & Rueckert, E., Aug. 2021, 2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings. Institute of Electrical and Electronics Engineers, (2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Buch/SammelbandForschung

  3. Veröffentlicht

    Investigating the influence of surface hardness and energy on the perceived stickiness of polymer coatings.

    Griesser, M., Ules, T., Schlogl, S. & Gruber, D. P., 6 Juli 2021, 2021 IEEE World Haptics Conference, WHC 2021. Institute of Electrical and Electronics Engineers, S. 1148 1 S. (2021 IEEE World Haptics Conference, WHC 2021).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  4. Veröffentlicht

    Effects of artificial ageing tests on EVA degradation: Influence of microclimate and methodology approach

    Barretta, C., Oreski, G., Kyranaki, N., Mansour, D. E., Betts, T. R., Bauermann, L. P. & Resch-Fauster, K., 20 Juni 2021, 2021 IEEE 48th Photovoltaic Specialists Conference, PVSC 2021. Institute of Electrical and Electronics Engineers, S. 312-315 4 S. (Conference Record of the IEEE Photovoltaic Specialists Conference).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  5. Veröffentlicht

    Development and Hardware-in-the-Loop Simulation of an Air Purifier Automatic Control System

    Babunski, D., Zaev, E., Poposki, F., Koleva, R. & Rath, G., 7 Juni 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Institute of Electrical and Electronics Engineers, 9460141. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  6. Veröffentlicht

    Hardware-in-the-loop for Simulation and Control of Greenhouse Climate

    Zaev, E., Babunski, D., Jovanov, A., Rath, G. & Payr, M. P., 7 Juni 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Budva: Institute of Electrical and Electronics Engineers, 9460206. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  7. Veröffentlicht

    Estimating Parameters of a Sine Wave by the Method of Variable Projection

    O'Leary, P. & Ninevski, D., 17 Mai 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 9459842. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; Band 2021-May).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  8. Veröffentlicht

    Instrumentation of a Roving Inspection Test Rig with Surface Geometry Measurement of Fiber Bundles

    Lehner, S., Neunkirchen, S., Fauster, E. & O'Leary, P., 17 Mai 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. IEEE Xplore (online): Institute of Electrical and Electronics Engineers, 9459889. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; Band 2021-May).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  9. Veröffentlicht

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  10. Veröffentlicht

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  11. Veröffentlicht

    Learning to Drive with Deep Reinforcement Learning

    Chukamphaeng, N., Pasupa, K., Antenreiter, M. & Auer, P., 21 Jan. 2021, KST 2021 - 2021 13th International Conference Knowledge and Smart Technology. Institute of Electrical and Electronics Engineers, S. 147-152 6 S. 9415770. (KST 2021 - 2021 13th International Conference Knowledge and Smart Technology).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband