Measurement of WBG-based power supplies

Zhu, H., Jafari, A., MacHtinger, K., Makoschitz, M. & Matioli, E., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).

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The Influence of Isolation on Learning in an Immersive Laboratory Environment

Holly, M., Sommer, S., Ruh, T., Stadlbauer, D., Rameshan, C. & Pirker, J., 2023, International Conference on Advanced Learning Technologies (ICALT). Chang, M., Chen, N.-S., Kuo, R., Rudolph, G., Sampson, D. G. & Tlili, A. (Hrsg.). Institute of Electrical and Electronics Engineers, Band 2023. S. 285-289 5 S. (2023 IEEE International Conference on Advanced Learning Technologies (ICALT)).

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Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

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Application of Artificial Neural Network to Predict the Thermal and Thermomechanical Behavior of Refractory Linings

Hou, A., Jin, S., Gruber, D. & Harmuth, H., 2022, 2022 International Joint Conference on Neural Networks, IJCNN 2022 - Proceedings. Institute of Electrical and Electronics Engineers, (Proceedings of the International Joint Conference on Neural Networks; Band 2022-July).

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A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

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Characterization and modeling of a typical curing material for photoresist films

Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

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Dynamic Mechanical Response in Epoxy Nanocomposites Incorporating Various Nano-Silica Architectures

Chaudhary, S., Vryonis, O., Vaughan, A. S., Andritsch, T. & Feuchter, M., 2022, ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings. Institute of Electrical and Electronics Engineers, S. 86-89 4 S. (ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings).

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Hybrid Machine Learning for Anomaly Detection in Industrial Time-Series Measurement Data

Terbuch, A., O'Leary, P. & Auer, P., 2022, I2MTC 2022 - IEEE International Instrumentation and Measurement Technology Conference: Instrumentation and Measurement under Pandemic Constraints, Proceedings. Institute of Electrical and Electronics Engineers, (Conference Record - IEEE Instrumentation and Measurement Technology Conference).

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System Identification under General Norms for Linear Parameter Varying State-Space Systems via Sparse Matrix Methods

Harker, M. & Rath, G., 2022, 2022 IEEE/SICE International Symposium on System Integration, SII 2022. Institute of Electrical and Electronics Engineers, S. 317-322 6 S. (2022 IEEE/SICE International Symposium on System Integration, SII 2022).

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Decomposition of a Periodic Perturbed Signal with Unknown Perturbation Frequency by the Method of Variable Projection

Handler, J., Ninevski, D. & O'Leary, P., 20 Dez. 2021, 2021 7th International Conference on Mechanical Engineering and Automation ICMEAS 2021. Institute of Electrical and Electronics Engineers

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