Institute of Electrical and Electronics Engineers
Herausgeber (Verlag): Verlag/Herausgebende Institution › Herausgeber (Verlag)
Publikationen
- Veröffentlicht
Influence of environmental factors like temperature and humidity on MEMS packaging materials.
Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov. 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Industrial application of a linear drive system in a pump testing facility
Langbauer, C. & Kaserer, G., 18 Apr. 2018, Proceedings - 2018 17th International Ural Conference on AC Electric Drives, ACED 2018. Institute of Electrical and Electronics Engineers, Band 2018-April. S. 1-5 5 S.Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Improved Predictive Model for Surge/Swab Pressure Estimation using a New Simplified (NS) Model
Ridha, S., Khanbesh, S., Arain, A. H., Yusuf, M. & Krishna, S., 2023, 2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023. Institute of Electrical and Electronics Engineers, (2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Improved nanoindentation methods for polymer based multilayer film cross-sections
Christoefl, P., Jakes, J. E., Geier, J., Pinter, G., Oreski, G., Stone, D. & Teichert, C., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Identifying the potential of SiC technology for PV inverters
Eskilson, T., Jehle, A., Schmidt, P., Makoschitz, M. & Baumgartner, F., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Hybrid Machine Learning for Anomaly Detection in Industrial Time-Series Measurement Data
Terbuch, A., O'Leary, P. & Auer, P., 2022, I2MTC 2022 - IEEE International Instrumentation and Measurement Technology Conference: Instrumentation and Measurement under Pandemic Constraints, Proceedings. Institute of Electrical and Electronics Engineers, (Conference Record - IEEE Instrumentation and Measurement Technology Conference).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
H∞-Based Double Grid Forming Controller of Multi-Modular Converters in a Hybrid AC/DC Grid
Eder, B. P., Adolfo, A., Markus, M. & Florian, D., 25 Juni 2023, 2023 IEEE 24th Workshop on Control and Modeling for Power Electronics, COMPEL 2023. Institute of Electrical and Electronics Engineers, (2023 IEEE 24th Workshop on Control and Modeling for Power Electronics, COMPEL 2023).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Hardware-in-the-loop for Simulation and Control of Greenhouse Climate
Zaev, E., Babunski, D., Jovanov, A., Rath, G. & Payr, M. P., 7 Juni 2021, 2021 10th Mediterranean Conference on Embedded Computing, MECO 2021. Budva: Institute of Electrical and Electronics Engineers, 9460206. (2021 10th Mediterranean Conference on Embedded Computing, MECO 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Hardware implementation and characterization of SiC-based hybrid three-phase rectifier employing third harmonic injection
Makoschitz, M., Hartmann, M. & Ertl, H., 10 Mai 2016, 2016 IEEE Applied Power Electronics Conference and Exposition, APEC 2016. Institute of Electrical and Electronics Engineers, S. 1-8 8 S. 7467844. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC; Band 2016-May).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Grid Load Mitigation in EV Fast Charging Stations Through Integration of a High-Performance Flywheel Energy Storage System with CFRP Rotor
Buchroithner, A., Presmair, R., Haidl, P., Wegleiter, H., Thormann, B., Kienberger, T., Auer, P. & Domitner, J., 2021, 2021 IEEE Green Energy and Smart Systems Conference, IGESSC 2021. Institute of Electrical and Electronics Engineers, (2021 IEEE Green Energy and Smart Systems Conference, IGESSC 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband