Institute of Electrical and Electronics Engineers
Herausgeber (Verlag): Verlag/Herausgebende Institution › Herausgeber (Verlag)
Publikationen
- Veröffentlicht
Multi-physics simulation of the component attachment within embedding process
Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr. 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, S. 1-6 6 S.Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Modelling Periodic Measurement Data Having a Piecewise Polynomial Trend Using the Method of Variable Projection
Handler, J., Ninevski, D. & O'Leary, P., Okt. 2023, IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics EngineersPublikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Modeling of electrical networks in the cellular approach with regard to influencing variables on active and reactive power accuracy at different voltage levels
Traupmann, A. & Kienberger, T., 2019Publikationen: Elektronische/multimediale Veröffentlichungen › Webpublikation oder Website › Forschung
- Veröffentlicht
MEMS Based Inclinometers: Noise Characteristics and Suitable Signal Processing: Noise characteristics and suitable signal processing
Schmidt, R., O'Leary, P., Ritt, R. & Harker, M., 5 Juli 2017, I2MTC 2017 - 2017 IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 7969830Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Measurement of WBG-based power supplies
Zhu, H., Jafari, A., MacHtinger, K., Makoschitz, M. & Matioli, E., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Learning to Drive with Deep Reinforcement Learning
Chukamphaeng, N., Pasupa, K., Antenreiter, M. & Auer, P., 21 Jan. 2021, KST 2021 - 2021 13th International Conference Knowledge and Smart Technology. Institute of Electrical and Electronics Engineers, S. 147-152 6 S. 9415770. (KST 2021 - 2021 13th International Conference Knowledge and Smart Technology).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Investigating the influence of surface hardness and energy on the perceived stickiness of polymer coatings.
Griesser, M., Ules, T., Schlogl, S. & Gruber, D. P., 6 Juli 2021, 2021 IEEE World Haptics Conference, WHC 2021. Institute of Electrical and Electronics Engineers, S. 1148 1 S. (2021 IEEE World Haptics Conference, WHC 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Instrumented Milling Process and Analysis for Tool Wear Measurement
Ninevski, D., Yifrach, Y. & O'Leary, P., 2023, 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (I2MTC 2023). Kuala Lumpur, Malaysia: Institute of Electrical and Electronics EngineersPublikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Instrumentation of a Roving Inspection Test Rig with Surface Geometry Measurement of Fiber Bundles
Lehner, S., Neunkirchen, S., Fauster, E. & O'Leary, P., 17 Mai 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. IEEE Xplore (online): Institute of Electrical and Electronics Engineers, 9459889. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; Band 2021-May).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Input Impedance Modeling of Three-Level Multi-Stage NPC Topology
Makoschitz, M., Stoeckl, J. & Hribernik, W., 28 Aug. 2018, 2018 IEEE Transportation and Electrification Conference and Expo, ITEC 2018. Institute of Electrical and Electronics Engineers, S. 881-884 4 S. 8450192. (2018 IEEE Transportation and Electrification Conference and Expo, ITEC 2018).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband