System Identification under General Norms for Linear Parameter Varying State-Space Systems via Sparse Matrix Methods

Harker, M. & Rath, G., 2022, 2022 IEEE/SICE International Symposium on System Integration, SII 2022. Institute of Electrical and Electronics Engineers, S. 317-322 6 S. (2022 IEEE/SICE International Symposium on System Integration, SII 2022).

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Decomposition of a Periodic Perturbed Signal with Unknown Perturbation Frequency by the Method of Variable Projection

Handler, J., Ninevski, D. & O'Leary, P., 20 Dez. 2021, 2021 7th International Conference on Mechanical Engineering and Automation ICMEAS 2021. Institute of Electrical and Electronics Engineers

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Modelling Periodic Measurement Data Having a Piecewise Polynomial Trend Using the Method of Variable Projection

Handler, J., Ninevski, D. & O'Leary, P., Okt. 2023, IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics Engineers

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Robust machine vision based displacement analysis for tunnel boring machines

Gugg, C. & O'Leary, P., 6 Juli 2015, Conference Record - IEEE Instrumentation and Measurement Technology Conference. Institute of Electrical and Electronics Engineers, Band 2015-July. S. 875-880 6 S. 7151384

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An Algebraic Framework for the Real-Time Solution of Inverse Problems on Embedded Systems

Gugg, C., Harker, M., O'Leary, P. & Rath, G., 26 Aug. 2015, (Elektronische Veröffentlichung vor Drucklegung.) 12th IEEE International Conference on Embedded Software and Systems. Institute of Electrical and Electronics Engineers, S. 1097 - 1102 15635204

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Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 März 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

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Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

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Investigating the influence of surface hardness and energy on the perceived stickiness of polymer coatings.

Griesser, M., Ules, T., Schlogl, S. & Gruber, D. P., 6 Juli 2021, 2021 IEEE World Haptics Conference, WHC 2021. Institute of Electrical and Electronics Engineers, S. 1148 1 S. (2021 IEEE World Haptics Conference, WHC 2021).

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Identifying the potential of SiC technology for PV inverters

Eskilson, T., Jehle, A., Schmidt, P., Makoschitz, M. & Baumgartner, F., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).

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