Automatic Synthesis of Admissible Functions for Variational Learning

O'Leary, P., Ninevski, D. & Terbuch, A., 2023, 2023 IEEE International Conference on Computational Intelligence and Virtual Environments for Measurement Systems and Applications (CIVEMSA 2023). Institute of Electrical and Electronics Engineers

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

A Flexible CAEX Based Model for Standard Integration in Tunnelling

Paskaleva, G., Mazak-Huemer, A., Waldhart, J. & Ehrbar, H., 2021, 2021 ETFA – IEEE 26th International Conference on Emerging Technologies and Factory Automation. Institute of Electrical and Electronics Engineers, S. 1-8 8 S.

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Characterization and modeling of a typical curing material for photoresist films

Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics

Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Oscillation Damping With Input Shaping in Individual Metering Hydraulic Systems

Rath, G., Zaev, E. & Babunski, D., 1 Juni 2019, 2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings. Stojanovic, R., Jozwiak, L., Lutovac, B. & Jurisic, D. (Hrsg.). Institute of Electrical and Electronics Engineers, 8760056. (2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Improved Predictive Model for Surge/Swab Pressure Estimation using a New Simplified (NS) Model

Ridha, S., Khanbesh, S., Arain, A. H., Yusuf, M. & Krishna, S., 2023, 2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023. Institute of Electrical and Electronics Engineers, (2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Simultaneous approximation of measurement values and derivative data using discrete orthogonal polynomials

Ritt, R., Harker, M. & O'Leary, P., 1 Mai 2019, Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019. Institute of Electrical and Electronics Engineers, S. 282-289 8 S. 8780356. (Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

A probabilistic approach for complete coverage path planning with low-cost systems

Rottmann, N., Denz, R., Bruder, R. & Rueckert, E., Aug. 2021, 2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings. Institute of Electrical and Electronics Engineers, (2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Buch/Sammelband › Forschung

Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband